Thinfilm partners with US developers on sensor device for healthcare


The US FlexTech Alliance is supporting a project to develop and manufacture an integrated printed sensor system for use in healthcare applications.

Thinfilm is supplying its Addressable Memory for the medical sensors. Image: ThinfilmIn the project a printed sensor platform developed by PARC and Thin Film Electronics (Thinfilm) is being integrated with temperature sensing, and an oxygen sensor under development at the University of California at Berkeley.

Potential products include a simple, unobtrusive biosensor that can be used as part of treatment for respiratory diseases – known as pulse oximetry – to monitor the percentage of haemoglobin that is oxygen-saturated.

Medical kit

Pulse oximeters are used routinely in critical care, anaesthesiology, accident and emergency departments, ambulances, and are an increasingly common part of a general practitioner’s (GP) kit. The device being developed in the FlexTech-funded project will pave the way for low-cost medical sensors that patients can wear at home.

Thinfilm is supplying its Addressable Memory for the project, which combines Thinfilm’s Passive Array Memory with printed CMOS-equivalent logic. The technology platform is used for printed electronic systems, such as temperature sensors and non-contact ID tags.

The project will demonstrate the first integrated printed sensor circuitry, and provide reference designs for sensor control and integration with other devices. The building blocks of these designs will be made by gravure printing.

Thinfilm CEO Davor Sutija says: ‘The applications enabled by this project will address the homecare and patient care market. Through our close work with PARC we have developed a platform technology. We are starting to see other institutes and organisations developing components that are compatible with our platform, for various different markets and applications.’

Computer Chips Get Smaller .. Cost Less .. with Nanotechnology


Printing Graphene Chips(Nanowerk News) Not so long ago, a computer filled a  whole room and radio receivers were as big as washing machines. In recent  decades, electronic devices have shrunk considerably in size and this trend is  expected to continue, leading to enormous cost and energy savings, as well as  increasing speed.
Key to shrinking devices is Terascale computing, involving  ultrafast technology supported by single microchips that can perform trillions  of operations per second.
Using Terascale technology, semiconductor components commonly  used to make integrated circuits for all kinds of appliances could measure less  than 10 nanometres within several years. Keeping in mind that a nanometre is  less than 1 billionth of a metre, electronic devices have the potential to  become phenomenally smaller and require significantly less energy than today – a  development that will revolutionise the electronics industry.
Despite progress, the technology for producing these ultra-small  devices has a long way to go before being reliable. To advance the work, the  EU-funded project TRAMS (‘Terascale reliable adaptive memory  systems’) sought to improve reliability by improving chip design.
The TRAMS team conducted in-depth variability and reliability  analyses to develop chip circuits that are much less prone to errors. These  circuits feature new designs that yield reliable memory systems from currently  unreliable nanodevices.
The main challenge was to develop reliable, energy efficient and  cost effective computing using a variety of new technologies with individual  transistors potentially measuring below five nanometres in size.
The team investigated a number of technologies and materials  with potential to make Terascale computing a reality. These included:
  • carbon  nanotubes;
  • new  transistor geometries, such as FinFETs;
  • state-of-the-art  nanowires, which offer very advanced transistor capabilities for use in a new  generation of electronic devices.
Using models, the researchers analysed reliability – from the  technology to the circuit level.
These advances are expected to redefine today’s standard  ‘complementary metal-oxide semiconductors’ (CMOS). The team’s results would help  Europe’s manufacturers develop CMOS devices below the 16 nanometre range. The  biggest challenge will lie in reducing CMOS devices to below five nanometres – a  development that now starts to look possible.
From communication and security to transport and industry,  CMOS-based devices of the future promise to redesign the technology we use,  introducing radical energy and cost savings.
The TRAMS consortium includes universities and companies from  Spain, Belgium and the UK. The project was coordinated by Spain’s Universitat  Politècnica de Catalunya, and received almost EUR 2.5 million in EU funding. The  team concluded its work in December 2012.
Source: Cordis

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